Dynamic thermoelectric quick response code branding

ABSTRACT

Embodiments of the invention include an apparatus, a computer-implemented method, and a computer program product for branding a quick response code onto a surface. Aspects of the invention include a branding device having a plurality of thermoelectric devices on a substrate. Each of the thermoelectric devices is arranged on the substrate as a single bit in a quick response pattern. Each of the thermoelectric devices includes an n-type thermoelectric element electrically coupled to a p-type thermoelectric element. The thermoelectric elements can be individually heated or cooled using the Peltier effect.

BACKGROUND

The present invention generally relates to thermoelectric elements, andmore specifically, to a dynamic thermoelectric quick response codebranding.

Thermoelectric devices are small heat pumps with solid state electricalcomponents, known as thermoelectric elements, which leverage the Peltiereffect (or generally, the thermoelectric effect) to create a temperaturedifference between the junctions of two different types of materials.The direction of the heat flux depends on the direction of a currentapplied to the thermoelectric elements. Conventional thermoelectricdevices include two surfaces separated by at least one pair ofthermoelectric elements. These pairs typically include a P-typesemiconductor element and an N-type semiconductor element. The P-typeand N-type thermoelectric elements are arranged in arrays that alternatebetween P-type and N-type elements in both array directions.Thermoelectric elements are available today in very small packages andcan reach very high temperatures. For example, thermoelectric modulescan be smaller than 2.5 mm×2.5 mm×2.5 mm and can reach temperatures ofabout 200 degrees Celsius.

A quick response code is a type of matrix barcode that can be read by anoptical imaging device such as a camera and processed using Reed-Solomonerror correction. Quick response codes typically consist of black andwhite modules (square dots) arranged in a rectangular pattern. Each dotrepresents a bit of data (“0” or “1”) depending on whether the bit is“white” or “black.” Conventional quick response codes are detected as a2-dimensional digital image and can be digitally analyzed by aprogrammed processor. More recently, the use of quick response codes hasrapidly grown in the consumer advertising, packaging, inventorytracking, transport, manufacturing, and retail industries, due in partto the wide dissemination of smartphones having built-in barcode readeror scanner capabilities. Quick response codes provide a convenient meansof accessing online resources as well as a high storage capacity andfast decoding speed.

SUMMARY

Embodiments of the present invention are directed to an apparatus forbranding a quick response code onto a surface. A non-limiting example ofthe apparatus includes a plurality of thermoelectric devices on asubstrate. Each of the thermoelectric devices is arranged on thesubstrate as a single bit in a quick response pattern. Each of thethermoelectric devices includes an n-type thermoelectric elementelectrically coupled to a p-type thermoelectric element. Thethermoelectric elements can be individually heated or cooled using thePeltier effect.

Embodiments of the present invention are directed to acomputer-implemented method for branding a quick response code onto asurface. A non-limiting example of the method includes receiving, by aprocessor, data to be encoded into the quick response code. The methodincludes generating, by the processor, the quick response code thatencodes the data. The processor determines a first subset ofthermoelectric devices of a quick response branding device to heat togenerate the quick response code. The processor then sends programinstructions to heat the first subset of thermoelectric devices to thequick response branding device.

Embodiments of the present invention are directed to a computer programproduct for branding a quick response code onto a surface. Anon-limiting example of the computer program product includes a computerreadable storage medium having program instructions embodied therewith,the program instructions executable by a processing device to cause theprocessing device to perform a method. The method includes receivingdata to be encoded into the quick response code and generating the quickresponse code that encodes the data. The method further includesdetermining a first subset of thermoelectric devices of a quick responsebranding device to heat to generate the quick response code and sendingprogram instructions to heat the first subset of thermoelectric devicesto the quick response branding device.

Additional technical features and benefits are realized through thetechniques of the present invention. Embodiments and aspects of theinvention are described in detail herein and are considered a part ofthe claimed subject matter. For a better understanding, refer to thedetailed description and to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The specifics of the exclusive rights described herein are particularlypointed out and distinctly claimed in the claims at the conclusion ofthe specification. The foregoing and other features and advantages ofthe embodiments of the invention are apparent from the followingdetailed description taken in conjunction with the accompanying drawingsin which:

FIG. 1 depicts a block diagram of a computer system for use inimplementing one or more embodiments of the present invention;

FIG. 2 depicts a block diagram of a system for applying quick responsecodes to a wide variety of surfaces using dynamic thermoelectricbranding according to one or more embodiments of the present invention;

FIG. 3 depicts a first view of a quick response branding device searinghead formed according to one or more embodiments of the invention;

FIG. 4 depicts a second view of the quick response branding devicesearing head illustrated in FIG. 3 according to one or more embodimentsof the invention;

FIG. 5 depicts an expanded view of a single thermoelectric device formedaccording to one or more embodiments of the invention;

FIG. 6 depicts a blown-out view of a quick response branding devicesearing head according to one or more embodiments of the invention;

FIGS. 7A, 7B, and 7C each depict a possible searing arrangement ofthermoelectric devices according to one or more embodiments of theinvention;

FIGS. 8A-8D each depict a possible contact surface shape for athermoelectric device according to one or more embodiments of theinvention;

FIGS. 9A and 9B each depict a possible arrangement of thermoelectricdevices for generating a quick response code according to one or moreembodiments of the invention;

FIG. 10 depicts a method for operating a quick response branding devicein accordance with one or more embodiments of the present invention; and

FIG. 11 depicts a flow diagram of a method for branding a quick responsecode onto a substrate or product surface according to one or moreembodiments of the invention.

The diagrams depicted herein are illustrative. There can be manyvariations to the diagram or the operations described therein withoutdeparting from the spirit of the invention. For instance, the actionscan be performed in a differing order or actions can be added, deletedor modified. Also, the term “coupled” and variations thereof describeshaving a communications path between two elements and does not imply adirect connection between the elements with no interveningelements/connections between them. All of these variations areconsidered a part of the specification.

In the accompanying figures and following detailed description of thedisclosed embodiments, the various elements illustrated in the figuresare provided with two or three-digit reference numbers. With minorexceptions, the leftmost digit(s) of each reference number correspond tothe figure in which its element is first illustrated.

DETAILED DESCRIPTION

The present invention will now be described with reference to thedrawings, wherein like reference numerals are used to refer to likeelements throughout. It should be understood that the description ofthese aspects are merely illustrative and that they should not be takenin a limiting sense. In the following description, for purposes ofexplanation, numerous specific details are set forth in order to providea thorough understanding of the present invention. It will be evident toone skilled in the art, however, that the present invention can bepracticed without these specific details.

For the sake of brevity, conventional techniques related to making andusing aspects of the invention may or may not be described in detailherein. In particular, various aspects of computing systems and specificcomputer programs to implement the various technical features describedherein are well known. Accordingly, in the interest of brevity, manyconventional implementation details are only mentioned briefly herein orare omitted entirely without providing the well-known system and/orprocess details.

Referring to FIG. 1, there is shown an embodiment of a processing system100 for implementing the teachings herein. In this embodiment, thesystem 100 has one or more central processing units (processors) 21 a,21 b, 21 c, etc. (collectively or generically referred to asprocessor(s) 21). In one or more embodiments, each processor 21 caninclude a reduced instruction set computer (RISC) microprocessor.Processors 21 are coupled to system memory 34 and various othercomponents via a system bus 33. Read-only memory (ROM) 22 is coupled tothe system bus 33 and can include a basic input/output system (BIOS),which controls certain basic functions of system 100.

FIG. 1 further depicts an input/output (I/O) adapter 27 and a networkadapter 26 coupled to the system bus 33. I/O adapter 27 can be a smallcomputer system interface (SCSI) adapter that communicates with a harddisk 23 and/or tape storage drive 25 or any other similar component. I/Oadapter 27, hard disk 23, and tape storage device 25 are collectivelyreferred to herein as mass storage 24. Operating system 40 for executionon the processing system 100 can be stored in mass storage 24. A networkadapter 26 interconnects bus 33 with an outside network 36 enabling dataprocessing system 100 to communicate with other such systems. A screen(e.g., a display monitor) 35 is connected to system bus 33 by displayadaptor 32, which can include a graphics adapter to improve theperformance of graphics intensive applications and a video controller.In one embodiment, adapters 27, 26, and 32 can be connected to one ormore I/O busses that are connected to system bus 33 via an intermediatebus bridge (not shown). Suitable I/O buses for connecting peripheraldevices such as hard disk controllers, network adapters, and graphicsadapters typically include common protocols, such as the PeripheralComponent Interconnect (PCI). Additional input/output devices are shownas connected to system bus 33 via user interface adapter 28 and displayadapter 32. A keyboard 29, mouse 30, and speaker 31 all interconnectedto bus 33 via user interface adapter 28, which can include, for example,a Super I/O chip integrating multiple device adapters into a singleintegrated circuit.

In exemplary embodiments, the processing system 100 includes a graphicsprocessing unit 41. Graphics processing unit 41 is a specializedelectronic circuit designed to manipulate and alter memory to acceleratethe creation of images in a frame buffer intended for output to adisplay. In general, graphics processing unit 41 is very efficient atmanipulating computer graphics and image processing and has a highlyparallel structure that makes it more effective than general-purposeCPUs for algorithms where processing of large blocks of data is done inparallel.

Thus, as configured in FIG. 1, the system 100 includes processingcapability in the form of processors 21, storage capability includingsystem memory 34 and mass storage 24, input means such as keyboard 29and mouse 30, and output capability including speaker 31 and display 35.In one embodiment, a portion of system memory 34 and mass storage 24collectively store an operating system coordinate the functions of thevarious components shown in FIG. 1.

Turning now to an overview of technologies that are more specificallyrelevant to aspects of the present invention, as previously discussedherein, a quick response code is a type of the matrix barcode thatconsists of black and white modules that encode information which can beeasily read using an optical imaging device. Typical quick responsecodes use one or more of four standardized modes (numeric, alphanumeric,binary, and kanji) to efficiently store information about the item towhich it is attached. The ubiquity of smartphones has driven thewidespread adoption of quick response codes in a wide variety ofapplications, such as product tracking, item identification, timetracking, document management, and general marketing. Today's methodsfor applying quick response codes to product surfaces include printing,stamping, etching, and engraving. Consequently, the variety of surfaceson which a quick response code can be created is somewhat limited.Certain materials, products, and applications such as food, animalproducts, animal branding, wood, leather, etc. cannot use theseconventional methods due to contamination of the product or the lifetimeof the application. For example, cattle can be stamped with a quickresponse code, but the ink will wear off eventually.

Turning now to an overview of aspects of the present invention, one ormore embodiments of the invention provide a device, method, and computerprogram product for applying linear (one dimensional) and matrix (2-D)barcodes to a wide variety of surfaces using dynamic thermoelectricbranding. In some embodiments of the present invention, a quick responsebranding device having a flat surface searing head makes use of a matrixof thermoelectric devices to generate quick response codes. Eachthermoelectric device serves as a single quick response bit, i.e., theblack or white module in a conventional quick response code. This matrixof thermoelectric devices can be arranged in any version of a quickresponse code, for example, QR Version 1 to Version 40, iQR, micro QR,and DataMatrix. These thermoelectric devices can be individuallyprogrammed by changing the direction of current running throughthermoelectric elements attached to each thermoelectric device. In otherwords, the quick response branding device leverages the Peltier effectto heat or cool individual bits (the thermoelectric devices) to encode aunique quick response pattern. A single quick response branding devicecan be easily reconfigured into any quick response pattern by simplychanging the direction of current running through each of thethermoelectric devices.

The present invention enables the application of a quick response codeonto previously unavailable or suboptimal surfaces such as food, animalproducts, animal branding, leather, and wood using a contamination-freeprocess with long-term durability. The quick response branding devicecan be adapted for use in factory machinery, implemented into a handheldbranding iron, and used in the assembly line automation of foodproducts. For example, a hamburger or bun could contain a seared quickresponse code that is scanned to let a worker know what toppings to addto the specific customer's burger, or to automatically place saidtoppings. Quick response codes on food products can be used to advertiseor provide information directly to consumers. For example, a quickresponse code branded onto a pancake could be scanned by a customer tosee if the customer won a coupon for their next visit. A quick responsecode on a steak could be scanned to provide sourcing information such asthe location and other details of the cow the meat came from. In anotherexample, livestock branding (both searing and freezing) is used as proofof ownership over livestock and is recognized by law in many western USstates. By searing quick response codes onto livestock, ownership andother useful information can be easily discovered. This quick responsecode could be configured to launch a URL data type that logs thescanner's GPS location and notifies the owner as to the animal's currentlocation. In yet another example, branding is common on wood and leatherproducts; however, there is no current device that allows a single quickresponse head to be reconfigured to change the information stored withinthe preconfigured branded code.

Turning now to a more detailed description of aspects of the presentinvention, FIG. 2 depicts a system 200 for applying quick response codesto a wide variety of surfaces using dynamic thermoelectric brandingaccording to one or more embodiments of the present invention. Thesystem 200 includes a quick response branding device 202, a userinterface 204, a network 206, a quick response controller 208, and aquick response configuration program 210. In one or more embodiments ofthe invention, the quick response branding device 202, quick responsecontroller 208, user interface 204, network 206, and/or quick responseconfiguration program 210 can be implemented on the processing system100 found in FIG. 1.

As will be discussed in further detail herein, the quick responsebranding device 202 includes a matrix 302 of thermoelectric devices 304(depicted in FIG. 3) for generating quick response codes. The quickresponse branding device 202 can be a handheld device, or can be adaptedfor automatic machine use (e.g., factory equipment). The quick responsebranding device 202 can be programmed to generate a desired quickresponse code using the user interface 204. The user interface 204 canbe separate from, or integrated into, the quick response branding device202. The user interface 204 provides an interface to the quick responsereconfiguration program 210 on the quick response controller 208 for auser of the quick response branding device 202. In some embodiments ofthe present invention, user interface 204 can be a graphical userinterface (GUI) or a web user interface (WUI) and can display text,documents, web browser windows, user options, application interfaces,and instructions for operation, and include the information (such asgraphic, text, and sound) that a program presents to a user and thecontrol sequences the user employs to control the program. In anotherembodiment of the present invention, user interface 204 can be mobileapplication software that provides an interface between a user of thequick response branding device 202 and the quick response controller208. Mobile application software, or an “app,” is a computer programdesigned to run on smartphones, tablet computers, and other mobiledevices. User interface 204 enables the user of quick response brandingdevice 202 to register with the quick response controller 208 to adjustpreferences for quick response branding protocols, such as thetemperature, duration, and configuration of the thermoelectric devices304 (depicted in FIG. 3). However, user interface 204 is not limited tothe aforementioned examples and can be used to control any parametersassociated with the quick response configuration program 210. In yetanother embodiment, the quick response controller 208 can include aninstance of the user interface 204. For example, using the userinterface 204, a user can input branding parameters based on variouscategories such as the type of substrate being branded, the minimumdarkness of the branded material, and a desired quick response codepattern. In some embodiments of the present invention, a user can inputraw text or numeric data into the user interface 204 for encoding into aquick response pattern by the quick response configuration program 210.

The quick response branding device 202 leverages the Peltier effect toheat or cool individual bits (the thermoelectric devices 304 depicted inFIG. 3) to encode a unique quick response pattern. To that end, thequick response controller 208 includes a quick response configurationprogram 210 for determining the necessary current inputs to each of thethermoelectric devices 304. In some embodiments of the presentinvention, the quick response configuration program 210 sendsconfiguration parameters including individual current inputs for each ofthe thermoelectric devices 304 to the quick response branding device 202to configure the device for a particular branding application. Therequired current to heat or cool each of the thermoelectric devices 304varies in part depending on the size and material of the thermoelectricdevices 304. In some embodiments of the present invention, the requiredpower for heating or cooling each of the thermoelectric devices 304 isabout 0.21 milliwatts at 0.1 Volts and 0.21 Amps, although other powerrequirements are within the contemplated scope of the invention.

The configuration parameters can include any combination of variablesrequired to brand a linear barcode, a matrix barcode, or an image onto asubstrate using the Peltier effect to individually heat or cool thethermoelectric devices 304. Variables can include a subset of thethermoelectric devices 304 that will be heated or cooled to generate thedesired quick response code, a list of sequential subsets of thethermoelectric devices 304 that will be consecutively heated or cooledto generate the desired quick response code (as depicted in FIGS. 7B and7C), the identification of a product type being branded, a desireddarkness or lightness of the branded quick response code, and a lengthof branding time. It is understood, however, that these variables arenot limited to the embodiments disclosed herein and can be any variablesassociated with quick response branding techniques. The product (alsoknown as a branding surface or substrate) can be any material that canbe branded. A product can be, for example, cloth, leather, metal, wood,fur, plastic, animal hide, plant material, food products, or anycombination of the listed substrates. However, the substrates are notlimited to the materials listed herein. In some embodiments of thepresent invention, the quick response configuration program 210generates configuration parameters to heat a first subset of thethermoelectric devices 304. In some embodiments of the presentinvention, the quick response configuration program 210 generatesconfiguration parameters to heat a first subset of the thermoelectricdevices 304 and cool a second subset of the thermoelectric devices 304.

The quick response configuration program 210 determines one or moreexecutable program instructions to generate the one or moreconfiguration parameters required at the quick response branding device202. In some embodiments of the present invention, the quick responseconfiguration program 210 translates a received quick response patterninto one or more configuration parameters including machine readableinstructions by identifying the subset of thermoelectric devices 304which need to be heated and/or cooled to generate the desired pattern.The quick response configuration program 210 then communicates the listof currents for the thermoelectric devices 304 as one or more executableprogram instructions to the quick response controller 208.

The quick response controller 208 sends the one or more executableprogram instructions generated by the quick response configurationprogram 210 to the quick response branding device 202. In oneembodiment, the quick response configuration program 210 can sendexecutable program instructions via the network 206. For example, a usercan input configuration parameters into a laptop computer containing thequick response configuration program 210 which will subsequently sendthe executable program instructions associated with the inputconfiguration parameters over network 206 to the quick response brandingdevice 202. For example, the quick response configuration program 210can send program instructions to run a specific current through each ofthe thermoelectric devices 304 depending on the desired quick responsepattern. The specific current for a given thermoelectric device can beadjusted based on the previous state of that device. For example, thequick response configuration program 210 can designate a first “cooling”current for a first device and a second, lower “cooling” current for asecond device to account for the fact that the first device is hot(e.g., the device was heated in the previous stage of a multistatebranding application) while the second device is already cool (e.g., thedevice was not heated or was cooled in the previous stage of amultistate branding application).

The quick response branding device 202, user interface 204, quickresponse controller 208, and quick response configuration program 210can be interconnected over the network 206. The network 206 can be, forexample, a telecommunications network, a local area network (LAN), awide area network (WAN), such as the Internet, or a combination of thethree, and can include wired, wireless, or fiber optic connections. Thenetwork 206 can include one or more wired and/or wireless networks thatare capable of receiving and transmitting data, voice, and/or videosignals, including multimedia signals that include voice, data, andvideo information. In general, network 206 can be any combination ofconnections and protocols that will support communications between thequick response branding device 202 and the quick response controller208, and other computing devices (not shown) within the system 200.

FIG. 3 depicts a first view of a quick response branding device searinghead 300 according to one or more embodiments of the invention. In someembodiments of the present invention, the searing head 300 is coupled tothe quick response branding device 202. As depicted, the searing head300 includes a matrix 302 of thermoelectric devices 304 arranged on asubstrate 306 for generating a 9 by 9 module iQR pattern. It isunderstood, however, that the thermoelectric devices 304 can be arrangedinto any version of a linear or matrix barcode (QR Version 1 to Version40, IQR, micro QR code, etc.). Alternatively, the thermoelectric devices304 can be arranged into a high resolution grid having any desirednumber of “pixels” (e.g., 1280×720 devices for 720p, 1920×1080 devicesfor 1080p, 3840×2160 for 4K, etc.) for generating an image.

As discussed previously herein, the quick response branding device 202leverages the Peltier effect whereby the direction and magnitude ofcurrent flow for each of the thermoelectric devices 304 can be adjustedindividually to heat or cool each of the thermoelectric devices 304. Insome embodiments of the present invention, one of a pair of binarysear/no sear currents is sent to each of the thermoelectric devices 304.In other words, “dark” pixels in the image can be seared while “light”pixels are not seared. Alternatively, non-binary degrees of “shading”(i.e., gradient shading) can be provided in an image or pattern byadjusting the relative magnitude of current flow for each of thethermoelectric devices 304. For example, increasing the current flow toa thermoelectric device will increase the device's surface searingtemperature, resulting in a relatively darker sear in the correspondingpixel. Similarly, decreasing the current flow to a device will decreasethe device's surface searing temperature, resulting in a lighter sear inthe corresponding pixel. In some embodiments of the present invention, acontinuous spectrum of shading can be provided to generate greyscaleimages using the thermoelectric devices 304.

In some embodiments of the present invention, the thermoelectric devices304 each include a rectangular or square contact surface 308, althoughother surface geometries, such as circular, elliptical, superelliptical,and polygonal, are within the contemplated scope of the invention. Thecontact surface 308 can be formed using any suitable material forbranding, such as, for example, ceramics, plastics, or any dielectricmaterial exhibiting a high thermal conductivity. Ceramics, for example,are electrical insulations that provide adequate to good thermalconductivity. Accordingly, ceramics are well-suited as thermoelectricsubstrates. In some embodiments of the present invention, the contactsurface 308 includes a metal. Metal substrates, however, require arelatively thin insulating layer (not depicted) located between thecontact surface 308 and the thermoelectric elements 502 (depicted inFIG. 5) and the first interconnect layer 504 (depicted in FIG. 5) thatelectrically couples pairs of thermoelectric elements 502. In someembodiments of the present invention, the contact surface 308 is platedusing, for example, nickel (Ni), to provide a surface that is moreeasily cleaned. In some embodiments of the present invention, thethermoelectric devices 304 are potted in thermally and/or electricallyinsulating material, such as an epoxy or an acrylic, to fill (sometimesreferred to as underfill) the space between the contact surfaces 308without covering the surface of the contact surfaces 308.

The substrate 306 can be formed using any suitable material, such as,for example, a dielectric material. In some embodiments of the presentinvention, the substrate 306 is made of a same material as the contactsurface 308. In some embodiments of the present invention, the substrate306 is made of a dielectric having a poor thermal conductivity, such as,for example, a plastic.

The thermoelectric devices 304 can be sized to accommodate any desiredpattern size. In some embodiments of the present invention, each of thethermoelectric devices 304 includes a length of about 1.15 mm and aheight of about 1.15 mm, although other dimensions are within thecontemplated scope of the invention. In some embodiments of the presentinvention, the matrix 302 of thermoelectric devices 304 includes apattern size of about 12 mm by 12 mm, although other dimensions arewithin the contemplated scope of the invention. Each of thethermoelectric devices 304 can be separated by a pitch distance. In someembodiments of the present invention, the centerline-to-centerline pitchdistance is about 1.27 mm, although other pitch distances are within thecontemplated scope of the invention. Moreover, as depicted, the matrix302 includes thermoelectric devices 304 having a same or substantiallysame size (length, width, and depth). In some embodiments of the presentinvention, the matrix 302 includes thermoelectric devices 304 having twoor more unique dimensions. In some embodiments of the present invention,each of the thermoelectric devices 304 includes a unique dimension.

FIG. 4 depicts a second view of the quick response branding devicesearing head 300 according to one or more embodiments of the invention.As described previously herein, the searing head 300 includes a matrix302 of thermoelectric devices 304 arranged on a substrate 306 forgenerating a 9 by 9 module iQR pattern. As depicted, each of thethermoelectric devices 304 includes a pair of electrodes 400 formed on asurface of the substrate 306. Each pair of electrodes 400 electricallycouples one of the thermoelectric devices 304 to the quick responsebranding device 202. While each of the thermoelectric devices 304 isdepicted as having a pair of electrodes 400, other electrodeconfigurations are within the contemplated scope of the invention. Forexample, each of the thermoelectric devices 304 can be electricallycoupled to a single electrode pair or to two or more electrode pairs.

FIG. 5 depicts an expanded view of a single thermoelectric device 500 ofthe thermoelectric devices 304 according to one or more embodiments ofthe invention. The thermoelectric device 500 includes two or morethermoelectric elements 502. A first end of each of the thermoelectricelements 502 is coupled to the contact surface 308 using a firstinterconnect layer 504. A second end of each of the thermoelectricelements 502 is coupled to the substrate 306 using a second interconnectlayer 506. The second interconnect layer 506 is electrically coupled tothe pair of electrodes 400 using vias 508 formed in the substrate 306.In this manner, current can be transferred from a source in the quickresponse branding device 202 to the thermoelectric elements 502 throughthe vias 508.

The thermoelectric elements 502 can be made using any suitablethermoelectric material, such as, for example, n-type and p-type dopedsemiconductor material. The semiconductor material can be, for example,monocrystalline silicon (Si), silicon-germanium (SiGe), silicon carbide(SiC), III-V compound semiconductor, II-VI compound semiconductor, orany semiconductor material exhibiting a combination of high Seebeckcoefficient, high electrical conductivity, and low thermal conductivity,such as, for example, bismuth telluride (Bi₂Te₃). The semiconductormaterial can be doped using n-type dopants (e.g., phosphorus (P) orarsenic (As)) or p-type dopants (e.g., boron (B) or gallium (Ga)). Asdepicted, the thermoelectric device 500 includes four thermoelectricelements 502. In some embodiments of the present invention, thethermoelectric elements 502 are arranged into electrically coupled pairsof n-type and p-type semiconductors. In other words, each electrode 400is electrically coupled to a single pair of one p-type thermoelectricelement and one n-type thermoelectric element. In some embodiments ofthe present invention, the pairs of a single p-type thermoelectricelement and a single n-type thermoelectric element are themselvesstacked such that adjacent (above, below, or to the side) thermoelectricelements have an opposite doping type while diagonal thermoelectricelements have a same doping type.

The first and second interconnect layers 504 and 506, the vias 508, andthe electrodes 400 can be made of any suitable conducting material, suchas, for example, a metal (e.g., tungsten (W), titanium (Ti), tantalum(Ta), ruthenium (Ru), zirconium (Zr), cobalt (Co), copper (Cu), aluminum(Al), lead (Pb), platinum (Pt), tin (Sn), silver (Ag), gold (Au)), aconducting metallic compound material (e.g., tantalum nitride (TaN),titanium nitride (TiN), tantalum carbide (TaCx), titanium carbide (TiC),titanium aluminum carbide (Ti₃AlC₂), tungsten silicide (WSi₂), tungstennitride (WN₂), ruthenium oxide (RuO₂), cobalt silicide (CoSi₂), nickelsilicide (NiSi)), carbon nanotube, conductive carbon, graphene, or anysuitable combination of these materials. Moreover, the interconnectlayers 504 and 506, the vias 508, and the electrodes 400 can eachinclude a same or different conducting material.

FIG. 6 depicts a blown-out view of the quick response branding devicesearing head 300 according to one or more embodiments of the invention.As depicted, the searing head 300 includes a top layer 600, athermoelectric layer 602, and a bottom layer 604. From this view, theelectrical connections between the components of the searing head 300are more easily apparent. For example, a single electrode 400 iselectrically coupled to a pair of oppositely doped thermoelectricelements 502 using the second interconnect layer 506. The thermoelectriclayer 602 includes the thermoelectric elements 502 of the searing head300. As depicted, the thermoelectric elements 502 alternate in dopingtype along a first direction and a second direction.

FIGS. 7A, 7B, and 7C each depict a possible searing arrangement ofthermoelectric devices according to one or more embodiments of theinvention. As discussed previously herein, the thermoelectric devicesare individually heated or cooled. In some embodiments of the presentinvention, a desired quick response pattern is generating using a1-stage searing process, as depicted in FIG. 7A. In a 1-stage process,the thermoelectric devices are simultaneously heated or cooled dependingon whether each “bit” is shaded in the quick response pattern.

Alternatively, a single quick response pattern could be seared overmultiple rounds. During each round, only a subset of the thermoelectricdevices are heated or cooled. Advantageously, the subsets ofthermoelectric devices can be staggered such that each of thethermoelectric devices being heated during a particular searing round issurrounded by thermoelectric devices which are either “off” or cooling.In this manner, thermal bleeding is minimized and a greater imagedefinition is possible.

FIG. 7B depicts a 2-stage searing process. During the first stage, theactive thermoelectric devices in the first stage (labeled “1”) areheated if they are shaded and cooled if they are unshaded in the quickresponse pattern. While some of the thermoelectric devices in the firststage are heated, all of the thermoelectric devices in the second stage(labeled “2”) are cooled. During the second stage, the reverse occurs,with a subset of the active thermoelectric devices in the second stagebeing heated while all of the thermoelectric devices in the first stageare cooled. In this manner, thermoelectric devices adjacent on the left,right, top, and bottom would never be heated simultaneously.

FIG. 7C depicts a 4-stage searing process. The 4-stage process issimilar to the 2-stage process, except that during a single stage allthree other stages are inactive or cooled. For example, during the firststage, the active thermoelectric devices in the first stage (labeled“1”) are heated if they are shaded and cooled if they are unshaded inthe quick response pattern. While some of the thermoelectric devices inthe first stage are heated, all of the thermoelectric devices in thesecond stage (labeled “2”), third stage (labeled “3”), and fourth stage(labeled “4”) are cooled. Stage two, three, and four would then becycled through in a similar fashion. In this manner, thermoelectricdevices would never be heated simultaneously with any adjacentthermoelectric device (i.e., to the left, right, top, bottom, anddiagonals).

FIGS. 8A, 8B, 8C, and 8D each depict a possible contact surface shapefor a thermoelectric device according to one or more embodiments of theinvention. As discussed previously herein, the thermoelectric devicescan include a rectangular, square, circular, elliptical,superelliptical, and polygonal shape. The shape of the contact surfacecan be modified depending on the requirements of a particularapplication (quick response pattern size, substrate type, environmentalconditions, etc.). Depending on the particular application, the shape ofthe contact surface can be selected to minimize any expected blurringeffects. For example, some amount of blurring is expected whenattempting to sear a perfect square onto a food product). The amount ofblurring may or may not be sufficient to prevent the generated quickresponse code from being read. Some contact surface shapes are moresusceptible to blurring effects than others. In some embodiments of thepresent invention, the contact surfaces are shaped in such a way thatpotential thermal bleeding will not affect the readability ofneighboring quick response “bits” to ensure that the result accuratelyreflects the desired quick response code.

FIG. 8A depicts a rectangular or square shape. Rectangular shapes arewell-suited to applications having minimal blurring, although it isunderstood that a rectangular shape can be used in any application.Advantageously, rectangular shapes are somewhat easier and less costlyto manufacture than more complicated shapes. FIG. 8B depicts a polygonalshape, in particular, a heptagonal shape. It is understood, however,that other polygonal shapes are within the contemplated scope of theinvention. FIGS. 8C and 8D each depict a superimposed set ofsuperellipses. Advantageously, a contact surface can be shaped using aspecific superellipse to minimize or counteract a potential or expectedthermal bleeding associated with a given application.

FIGS. 9A and 9B each depict a possible arrangement of thermoelectricdevices for generating a quick response code according to one or moreembodiments of the invention. In some embodiments of the presentinvention, the size of each of the thermoelectric devices can be reducedwithout rendering the final quick response code unreadable. For example,FIG. 9A depicts a first configuration of thermoelectric devices. Thethermoelectric devices each include a same first size and each device isseparated by a first pitch. FIG. 9B depicts a second configuration ofthese thermoelectric devices. The first and second configurationsinclude the same number of thermoelectric devices. The size of thethermoelectric device footprint has been reduced (i.e., each includes asmaller second size) in the second configuration, but the thermoelectricdevices are separated by the same first pitch. In this manner, theoverall size of the generated quick response code is not changed. Insome embodiments of the present invention, the physical size of thethermoelectric devices is scaled down while maintaining each bit'scenter position until further scaling would render the final quickresponse pattern unreadable for the expected application. In otherembodiments of the present invention, the actual thermoelectric devicesin FIG. 9B have not been scaled down in size relative to FIG. 9A,rather, an imperfect sear has resulted in a “damaged” image whereby oneor more (potentially all) of the thermoelectric devices do not produce afully seared pixel (or fail to produce a sear at all). In other words,one or more of the pixels can be missing or only partially covered(seared), leaving a gap between one or more of the thermoelectricdevices. This can result from, for example, imperfect contact with theproduct (searing surface). In some embodiments of the present invention,error correction within the image or barcode mitigates this damage suchthat the resulting “damaged” image is still scannable.

FIG. 10 depicts a method for operating a quick response branding devicein accordance with one or more embodiments of the present invention. Theoperational steps of FIG. 10 begin by sending information to be encodedinto a quick response code to a processor (step 1000). In someembodiments of the present invention, a user enters information to beencoded into the user interface 204 (FIG. 2). Alternatively, a desiredquick response code can be directly input according to one or moreembodiments of the present invention. In some embodiments of the presentinvention, the processor is the quick response controller 208 (FIG. 2).The processor encodes the received information into a quick responsecode (step 1002). The information can be encoded into any type of linearor matrix barcode, such as QR Version 1 to Version 40, iQR, micro QR,and DataMatrix. In some embodiments of the present invention, the quickresponse code is generated using the quick response configurationprogram 210 (FIG. 2).

The processor then conditions the quick response branding device forgenerating the quick response code. A number of branding stages isdetermined (step 1004). In some embodiments of the present invention,the number of branding stages is 1, 2, or 4, although any number ofbranding stages is within the contemplated scope of the invention. Insome embodiments of the present invention, a user enters a desirednumber of branding stages into the user interface 204 (FIG. 2). In someembodiments of the present invention, the processor generates a requirednumber of branding stages based on, for example, the substrate type, thequick response code type, bit size, or any other factor indicating arisk of, or susceptibility to, thermal bleeding. For example, when usinga wood-based substrate susceptible to thermal bleeding the processor canselect or increase to a higher number of branding stages. Once thenumber of branding stages is determined, the processor sets a brandingstage counter to 1 (step 1006) and selects (activates) the correspondingquick response bit set “1” (step 1008).

The processor then sends one or more executable program instructions tothe quick response branding device. In some embodiments of the presentinvention, the quick response configuration program 210 and/or the quickresponse controller 208 sends program instructions to the brandingdevice to run a first current through shaded bits in the currentlyactive set (step 1010). In some embodiments of the present invention, asecond current is sent through unshaded bits in the currently active setas well as though all bits in any inactive bit sets (step 1012).Optionally, the second current can be zero such that no current is sentto the unselected bits. In this manner, the shaded bits in the currentset are heated (step 1014) while all other bits (unshaded bits in thecurrent set and all bits in other sets) are cooled (step 1016).

The processor then confirms whether the desired temperature has beenachieved for the currently selected bits (step 1018) based on thecurrent application. In some embodiments of the present invention, thedesired temperature is directly input into the user interface 204 (FIG.2). Alternatively, the processor generates a required brandingtemperature based on, for example, the substrate type, the quickresponse code type, bit size, or any other suitable factor. In someembodiments of the present invention, the quick response configurationprogram 210 receives status data associated with the quick responsebranding device 202. If the quick response branding device 202 statusdata does not meet one or more of the configuration parameters, i.e., ifthe desired temperature has not been achieved, the processor returns tosteps 1010 and 1012 and repeats the heating process. In some embodimentsof the present invention, the processor adjusts the bit currents to finetune the branding temperature. For example, the current sent to aparticular bit can be increased to increase the branding temperature ofthat bit.

If the desired temperature has been achieved, the quick responsebranding device can be brought into contact with the product (step1020). In some embodiments of the present invention, the processor orthe quick response branding device can indicate to the user that thetemperature is sufficient for the branding application. The indicationcan be, for example, visual (lighting or a lighting pattern) or auditory(a sound or sequence of sounds).

The processor then checks the current branding stage counter value(e.g., “1” or “3”) against the total number of branding stages (step1022). If the current branding stage is less than the total number ofbranding stages, the processor increments the branding stage countervalue and returns to step 1008 (step 1024). The process of heating andcooling bits then continues in a similar manner for the next brandingstage. If the current branding stage is more than or equal to the totalnumber of branding stages, the processor determines whether additionalproducts will be branded (step 1026). In some embodiments of the presentinvention, the user enters a total number of products into the userinterface 204 (FIG. 2). Alternatively, the processor can ask the userwhether additional products will be branded during step 1026.

If additional products will be branded, the processor determines whetherthe current quick response code needs to be changed (step 1028). In someembodiments of the present invention, the user confirms the currentquick response code, enters a new quick response code into the userinterface or enters new information to be encoded into a new quickresponse code into the user interface. If a new quick response code isrequired, the processor returns to step 1000 and the process continuesin substantially the same manner as for the first quick response code.If a new quick response code is not required, the processor can skip tostep 1006, where the process then continues in substantially the samemanner as for the first quick response code. In this manner, theprocessor continues to condition the quick response branding device forgenerating quick response codes until the final quick response code hasbeen applied to the product.

FIG. 11 depicts a method 1100 for branding a quick response code onto asubstrate or product surface in accordance with one or more embodimentsof the present invention. The method begins at step 1102 when data to beencoded into a quick response code is received. The data can be providedusing, for example, a user interface. Alternatively, the data can bereceived from a scanner, a camera, or an image capture application.

At step 1104, the method includes generating the quick response codethat encodes the received data. In some embodiments of the presentinvention, the quick response code is generated by a quick responsecontroller 208 using a quick response configuration program 210according to one or more embodiments of the present invention. The quickresponse code can be, for example, a QR Version 1 to Version 40 code, aniQR code, a micro QR code, a DataMatrix code, or any other suitablelinear or matrix barcode.

A first subset of thermoelectric devices of a quick response brandingdevice that must be heated to generate the quick response code isdetermined at step 1106. In some embodiments of the present invention,the first subset is identified by the quick response controller 208and/or the quick response configuration program 210. At step 1108,program instructions to heat the first subset of thermoelectric devicesis sent to the quick response branding device. In some embodiments ofthe present invention, the program instructions are transmitted over awired or wireless network 206, as discussed previously herein.

Additional processes can also be included. It should be understood thatthe processes depicted in FIGS. 10 and 11 represent illustrations andthat other processes can be added or existing processes can be removed,modified, or rearranged without departing from the scope and spirit ofthe present disclosure.

Various embodiments of the present invention are described herein withreference to the related drawings. Alternative embodiments can bedevised without departing from the scope of this invention. Althoughvarious connections and positional relationships (e.g., over, below,adjacent, etc.) are set forth between elements in the followingdescription and in the drawings, persons skilled in the art willrecognize that many of the positional relationships described herein areorientation-independent when the described functionality is maintainedeven though the orientation is changed. These connections and/orpositional relationships, unless specified otherwise, can be direct orindirect, and the present invention is not intended to be limiting inthis respect. Similarly, the term “coupled” and variations thereofdescribes having a communications path between two elements and does notimply a direct connection between the elements with no interveningelements/connections between them. All of these variations areconsidered a part of the specification. Accordingly, a coupling ofentities can refer to either a direct or an indirect coupling, and apositional relationship between entities can be a direct or indirectpositional relationship. As an example of an indirect positionalrelationship, references in the present description to forming layer “A”over layer “B” include situations in which one or more intermediatelayers (e.g., layer “C”) is between layer “A” and layer “B” as long asthe relevant characteristics and functionalities of layer “A” and layer“B” are not substantially changed by the intermediate layer(s).

The following definitions and abbreviations are to be used for theinterpretation of the claims and the specification. As used herein, theterms “comprises,” “comprising,” “includes,” “including,” “has,”“having,” “contains” or “containing,” or any other variation thereof,are intended to cover a non-exclusive inclusion. For example, acomposition, a mixture, process, method, article, or apparatus thatcomprises a list of elements is not necessarily limited to only thoseelements but can include other elements not expressly listed or inherentto such composition, mixture, process, method, article, or apparatus.

Additionally, the term “exemplary” is used herein to mean “serving as anexample, instance or illustration.” Any embodiment or design describedherein as “exemplary” is not necessarily to be construed as preferred oradvantageous over other embodiments or designs. The terms “at least one”and “one or more” are understood to include any integer number greaterthan or equal to one, i.e. one, two, three, four, etc. The terms “aplurality” are understood to include any integer number greater than orequal to two, i.e. two, three, four, five, etc. The term “connection”can include an indirect “connection” and a direct “connection.”

References in the specification to “one embodiment,” “an embodiment,”“an example embodiment,” etc., indicate that the embodiment describedcan include a particular feature, structure, or characteristic, butevery embodiment may or may not include the particular feature,structure, or characteristic. Moreover, such phrases are not necessarilyreferring to the same embodiment. Further, when a particular feature,structure, or characteristic is described in connection with anembodiment, it is submitted that it is within the knowledge of oneskilled in the art to effect such feature, structure, or characteristicin connection with other embodiments whether or not explicitlydescribed.

For purposes of the description hereinafter, the terms “upper,” “lower,”“right,” “left,” “vertical,” “horizontal,” “top,” “bottom,” andderivatives thereof shall relate to the described structures andmethods, as oriented in the drawing figures. The terms “overlying,”“atop,” “on top,” “positioned on” or “positioned atop” mean that a firstelement, such as a first structure, is present on a second element, suchas a second structure, wherein intervening elements such as an interfacestructure can be present between the first element and the secondelement. The term “direct contact” means that a first element, such as afirst structure, and a second element, such as a second structure, areconnected without any intermediary conducting, insulating orsemiconductor layers at the interface of the two elements.

The terms “about,” “substantially,” “approximately,” and variationsthereof, are intended to include the degree of error associated withmeasurement of the particular quantity based upon the equipmentavailable at the time of filing the application. For example, “about”can include a range of ±12%, 8% or 5%, or 2% of a given value.

The present invention can be a system, a method, and/or a computerprogram product at any possible technical detail level of integration.The computer program product can include a computer readable storagemedium (or media) having computer readable program instructions thereonfor causing a processor to carry out aspects of the present invention.

The computer readable storage medium can be a tangible device that canretain and store instructions for use by an instruction executiondevice. The computer readable storage medium can be, for example, but isnot limited to, an electronic storage device, a magnetic storage device,an optical storage device, an electromagnetic storage device, asemiconductor storage device, or any suitable combination of theforegoing. A non-exhaustive list of more specific examples of thecomputer readable storage medium includes the following: a portablecomputer diskette, a hard disk, a random access memory (RAM), aread-only memory (ROM), an erasable programmable read-only memory (EPROMor Flash memory), a static random access memory (SRAM), a portablecompact disc read-only memory (CD-ROM), a digital versatile disk (DVD),a memory stick, a floppy disk, a mechanically encoded device such aspunch-cards or raised structures in a groove having instructionsrecorded thereon, and any suitable combination of the foregoing. Acomputer readable storage medium, as used herein, is not to be construedas being transitory signals per se, such as radio waves or other freelypropagating electromagnetic waves, electromagnetic waves propagatingthrough a waveguide or other transmission media (e.g., light pulsespassing through a fiber-optic cable), or electrical signals transmittedthrough a wire.

Computer readable program instructions described herein can bedownloaded to respective computing/processing devices from a computerreadable storage medium or to an external computer or external storagedevice via a network, for example, the Internet, a local area network, awide area network and/or a wireless network. The network can comprisecopper transmission cables, optical transmission fibers, wirelesstransmission, routers, firewalls, switches, gateway computers and/oredge servers. A network adapter card or network interface in eachcomputing/processing device receives computer readable programinstructions from the network and forwards the computer readable programinstructions for storage in a computer readable storage medium withinthe respective computing/processing device.

Computer readable program instructions for carrying out operations ofthe present invention can be assembler instructions,instruction-set-architecture (ISA) instructions, machine instructions,machine dependent instructions, microcode, firmware instructions,state-setting data, configuration data for integrated circuitry, oreither source code or object code written in any combination of one ormore programming languages, including an object oriented programminglanguage such as Smalltalk, C++, or the like, and procedural programminglanguages, such as the “C” programming language or similar programminglanguages. The computer readable program instructions can executeentirely on the user's computer, partly on the user's computer, as astand-alone software package, partly on the user's computer and partlyon a remote computer or entirely on the remote computer or server. Inthe latter scenario, the remote computer can be connected to the user'scomputer through any type of network, including a local area network(LAN) or a wide area network (WAN), or the connection can be made to anexternal computer (for example, through the Internet using an InternetService Provider). In some embodiments, electronic circuitry including,for example, programmable logic circuitry, field-programmable gatearrays (FPGA), or programmable logic arrays (PLA) can execute thecomputer readable program instruction by utilizing state information ofthe computer readable program instructions to personalize the electroniccircuitry, in order to perform aspects of the present invention.

Aspects of the present invention are described herein with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems), and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer readable program instructions.

These computer readable program instructions can be provided to aprocessor of a general purpose computer, special purpose computer, orother programmable data processing apparatus to produce a machine, suchthat the instructions, which execute via the processor of the computeror other programmable data processing apparatus, create means forimplementing the functions/acts specified in the flowchart and/or blockdiagram block or blocks. These computer readable program instructionscan also be stored in a computer readable storage medium that can directa computer, a programmable data processing apparatus, and/or otherdevices to function in a particular manner, such that the computerreadable storage medium having instructions stored therein comprises anarticle of manufacture including instructions which implement aspects ofthe function/act specified in the flowchart and/or block diagram blockor blocks.

The computer readable program instructions can also be loaded onto acomputer, other programmable data processing apparatus, or other deviceto cause a series of operational steps to be performed on the computer,other programmable apparatus or other device to produce a computerimplemented process, such that the instructions which execute on thecomputer, other programmable apparatus, or other device implement thefunctions/acts specified in the flowchart and/or block diagram block orblocks.

The flowchart and block diagrams in the Figures illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods, and computer program products according to variousembodiments of the present invention. In this regard, each block in theflowchart or block diagrams can represent a module, segment, or portionof instructions, which comprises one or more executable instructions forimplementing the specified logical function(s). In some alternativeimplementations, the functions noted in the blocks can occur out of theorder noted in the Figures. For example, two blocks shown in successioncan, in fact, be executed substantially concurrently, or the blocks cansometimes be executed in the reverse order, depending upon thefunctionality involved. It will also be noted that each block of theblock diagrams and/or flowchart illustration, and combinations of blocksin the block diagrams and/or flowchart illustration, can be implementedby special purpose hardware-based systems that perform the specifiedfunctions or acts or carry out combinations of special purpose hardwareand computer instructions.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdescribed herein.

What is claimed is:
 1. An apparatus comprising: a plurality ofthermoelectric devices on a substrate, each of the thermoelectricdevices arranged on the substrate as a single bit in a linear or matrixbarcode pattern; wherein each of the thermoelectric devices comprises ann-type thermoelectric element electrically coupled to a p-typethermoelectric element.
 2. The apparatus of claim 1, wherein the linearor matrix barcode pattern is a quick response pattern or a DataMatrixpattern.
 3. The apparatus of claim 2, wherein the quick response patternis a quick response (QR) Version 1 to Version 40 pattern, an iQRpattern, or a micro QR pattern.
 4. The apparatus of claim 1, whereineach of the thermoelectric devices comprises two or more pairs ofthermoelectric elements, each pair comprising an n-type thermoelectricelement electrically coupled to a p-type thermoelectric element.
 5. Theapparatus of claim 1, wherein each of the thermoelectric devices furthercomprises a contact surface coupled to an end of the n-type and p-typethermoelectric elements.
 6. The apparatus of claim 5, wherein eachcontact surface comprises a rectangular or superelliptical shape.
 7. Theapparatus of claim 1 further comprising a plurality of electrodes formedon a surface of the substrate, each electrode electrically coupled to athermoelectric device of the plurality of thermoelectric devices.
 8. Theapparatus of claim 7 further comprising a plurality of vias in thesubstrate, each via electrically coupling an electrode to athermoelectric device.
 9. The apparatus of claim 1, wherein the linearor matrix barcode pattern comprises a high resolution grid.
 10. Acomputer-implemented method for branding a quick response code onto asurface, the method comprising: receiving, by a processor, data to beencoded into the quick response code; generating, by the processor, thequick response code that encodes the data; determining, by theprocessor, a first subset of thermoelectric devices of a quick responsebranding device to heat to generate the quick response code; andsending, by the processor, program instructions to heat the first subsetof thermoelectric devices to the quick response branding device.
 11. Thecomputer-implemented method of claim 10 further comprising determining,by the processor, a second subset of thermoelectric devices of the quickresponse branding device to cool to generate the quick response code.12. The computer-implemented method of claim 11 further comprisingsending, by the processor, program instructions to cool the secondsubset of thermoelectric devices to the quick response branding device.13. The computer-implemented method of claim 11, wherein the firstsubset of thermoelectric devices is heated while the second subset ofthermoelectric devices is cooled.
 14. The computer-implemented method ofclaim 10, wherein the quick response code is a quick response (QR)Version 1 to Version 40 pattern, an iQR pattern, or a micro QR pattern.15. The computer-implemented method of claim 10 further comprisingdetermining, by the processor, a second subset of thermoelectric devicesof the quick response branding device to heat to generate the quickresponse code.
 16. The computer-implemented method of claim 15 furthercomprising sending, by the processor, program instructions to heat thesecond subset of thermoelectric devices to the quick response brandingdevice.
 17. A computer program product for branding a quick responsecode onto a surface, the computer program product comprising: a computerreadable storage medium having program instructions embodied therewith,the program instructions executable by a processing device to cause theprocessing device to perform a method comprising: receiving data to beencoded into the quick response code; generating the quick response codethat encodes the data; determining a first subset of thermoelectricdevices of a quick response branding device to heat to generate thequick response code; and sending program instructions to heat the firstsubset of thermoelectric devices to the quick response branding device.18. The computer program product of claim 17 further comprisingdetermining a second subset of thermoelectric devices of the quickresponse branding device to cool to generate the quick response code.19. The computer program product of claim 18 further comprising sendingprogram instructions to cool the second subset of thermoelectric devicesto the quick response branding device.
 20. The computer program productof claim 19, wherein the first subset of thermoelectric devices isheated while the second subset of thermoelectric devices is cooled.